Adhesive interactions with wood

Home » Knowledge Base » Knowledge Base Article





	Today's Sponsors: SIS Machinery Nebraska Tool NEMI New England Kiln Drying Association Newman Whitney Norment and Lambert North Pacific Lumber Northtech Machinery NPO BARS Nydree Flooring Nyle Dry Kiln Systems O'Shea Lumber Company Old Mississippi Brick and Heart Pine Company OMGA, Inc. Omnitech Systems Onsrud Cutter Opti-Sand Original Saw Company Osolnik Machinery & Supplies Paul Saws and Systems People Logic Software Corp. Peter Meier Inc. Pinske Edge Pioneer Lumber Company Planit Solutions Inc. plastiMACH Plogic Solutions Ltd. Pond Cove Paint Porter-Cable Precision Drive Systems Precision Saw Sharpeners Premium Specialty Hardwoods Pricecutter.com Prime Estimating and Software Services, LLC Pro.Woodworker.com Professional Hardware & Supply Co. Q1 Machinery Quality VAKuum Products, Inc. Quick Machinery Company Quickscrews International Corporation QuickScribe QuickWood QuikDrawers Quis Machinery R&R Drummond, Inc. R.A.W. R.D. Billhofer Company Rangate Rawles-Aden Lumber Corp. RazorGage Reliance Building Products Restoration Specialists Rex Lumber Company Riethmiller Lumber Ritter Manufacturing Inc. Rockler Woodworking and Hardware Roger Shaw and Associates Rose Machinery Routech Royce Ayr Cutting Tools RT Machine Co. Safe Passage Consulting Safety Speed Cut Sand-Rite Manufacturing Sandman Products Saw Trax Mfg. Sawmill and Woodlot Magazine Schmalz, Inc. Schultz Forming Products Scientific Dust Collectors SCM Group USA, Inc. SCM Group SCM SDN Contracting Seagrave Coatings Corporation Sears Trostel Lumber Co. Shade Dri Sherburne Machine Development Shomaker Lumber Company ShopBot SII Dry Kilns Silvaris Simantech

WOODWEB DISCLAIMS any and all RESPONSIBILITY and LIABILITY for the accuracy and application of the information below. Readers agree to evaluate the significance and limitations of the information provided, and accept full responsibility for the application of this information. Read More ...

Would you like to add information to this article?
Interested in writing or submitting an article?
Have a question about this article?

Adhesive interactions with wood While the chemistry for the polymerization of wood adhesives has been studied systematically and extensively, the critical aspects of the interaction of adhesives with wood are less clearly understood. General theories of bond formation need to be modified to take into account the porosity of wood and the ability of chemicals to be absorbed into the cell wall. Sufficient penetration is important for good bond formation, but it is not clear whether the penetration into lumens or the cell wall is more critical. For the bond forming process, thermodynamic wetting and viscosity are critical, but viscoelastic energy dissipation is important for the debonding process. The interphase formed during bond formation should influence the bonded assembly's ability to dissipate the internal and external stress during use, but the exact relationship is not clear. Studying of the bonding and debonding processes can be broken down into examination on the millimeter, micrometer, and nanometer spatial scales. The millimeter and larger scale is what is used for typical evaluations. However, the micrometer scale plays an important role because this scale relates to the cross-sectional size of cells that are the basic structural unit of wood. In this study, models are proposed for the adhesive--wood interphase that would reduce the stress concentration between the wood and the adhesive as the dimensions of the wood vary with changes in the wood moisture content. The nanometer scale is important because it relates to the interaction of the adhesive with the wood on the scale of the cellulose fibrils and the hemicellulose and lignin domains. The internal and external forces on the adhesive wood bond vary considerably for different products, such as laminated lumber, plywood, oriented strandboard (OSB), and fiberboard. A better understanding of the critical aspects of the adhesive--wood interaction should lead to a more efficient development of improved adhesives. 2004 This article is in PDF format (file size: 8129 kb). To download this article, right click on the link immediately below and choose "save target as". To view the article, left click the link immediately below.
(Download the latest Acrobat Reader if required.)

Adhesive interactions with wood (2004)

While the chemistry for the polymerization of wood adhesives has been studied systematically and extensively, the critical aspects of the interaction of adhesives with wood are less clearly understood. General theories of bond formation need to be modified to take into account the porosity of wood and the ability of chemicals to be absorbed into the cell wall. Sufficient penetration is important for good bond formation, but it is not clear whether the penetration into lumens or the cell wall is more critical. For the bond forming process, thermodynamic wetting and viscosity are critical, but viscoelastic energy dissipation is important for the debonding process. The interphase formed during bond formation should influence the bonded assembly's ability to dissipate the internal and external stress during use, but the exact relationship is not clear. Studying of the bonding and debonding processes can be broken down into examination on the millimeter, micrometer, and nanometer spatial scales. The millimeter and larger scale is what is used for typical evaluations. However, the micrometer scale plays an important role because this scale relates to the cross-sectional size of cells that are the basic structural unit of wood. In this study, models are proposed for the adhesive--wood interphase that would reduce the stress concentration between the wood and the adhesive as the dimensions of the wood vary with changes in the wood moisture content. The nanometer scale is important because it relates to the interaction of the adhesive with the wood on the scale of the cellulose fibrils and the hemicellulose and lignin domains. The internal and external forces on the adhesive wood bond vary considerably for different products, such as laminated lumber, plywood, oriented strandboard (OSB), and fiberboard. A better understanding of the critical aspects of the adhesive--wood interaction should lead to a more efficient development of improved adhesives.

Author: Frihart, Charles R.

Source: Fundamentals of composite processing : proceedings of a workshop, November 5-6, 2003. Madison, WI : U.S. Department of Agriculture, Forest Service, Forest Products Laboratory, 2004. General technical report FPL ; FPL-GTR-149: Pages 29-38

Citation: Frihart, Charles R. 2004. Adhesive interactions with wood Fundamentals of composite processing : proceedings of a workshop, November 5-6, 2003. Madison, WI : U.S. Department of Agriculture, Forest Service, Forest Products Laboratory, 2004. General technical report FPL ; FPL-GTR-149: Pages 29-38.

Have you reviewed the related Knowledge Base areas below?

KnowledgeBase: FPL (Forest Products Laboratory)

KnowledgeBase: Forestry

KnowledgeBase: FPL (Forest Products Laboratory)

Would you like to add information to this article? ... Click Here

If you have a question regarding a Knowledge Base article, your best chance at uncovering an answer is to search the entire Knowledge Base for related articles or to post your question at the appropriate WOODWEB Forum. Before posting your message, be sure to review our Forum Guidelines.

Questions entered in the Knowledge Base Article comment form will not generate responses! A list of WOODWEB Forums can be found at WOODWEB's Site Map.

When you post your question at the Forum, be sure to include references to the Knowledge Base article that inspired your question. The more information you provide with your question, the better your chances are of receiving responses.

Return to beginning of article.

Refer a Friend || Read This Important Information || Site Map || Privacy Policy

Letters, questions or comments? E-Mail us and let us know what you think. Be sure to review our Frequently Asked Questions page.

Contact us to discuss advertising or to report problems with this site.

To report a problem, send an e-mail to our Webmaster

Copyright © 1996-2008 - WOODWEB ® Inc.
All rights reserved. No part of this publication may be reproduced in any manner without permission of the Editor.
Review WOODWEB's Copyright Policy.

The editors, writers, and staff at WOODWEB try to promote safe practices. What is safe for one woodworker under certain conditions may not be safe for others in different circumstances. Readers should undertake the use of materials and methods discussed at WOODWEB after considerate evaluation, and at their own risk.

WOODWEB, Inc.
RR4 Box 265A
Montrose, PA 18801

Contact WOODWEB